May 2023
Two-dimensional layered materials (2D-LMs) materials have outstanding physical, chemical and thermal properties that make them attractive for the fabrication of solid-state micro/nano-electronic devices and circuits. However, synthesizing high-quality 2D-LMs at the wafer scale is difficult, and integrating them in semiconductor production lines brings associated multiple challenges. Nevertheless, in the past few years substantial progress has been achieved and leading companies like TSMC, Samsung and Imec have started to work more intensively on the fabrication of devices using 2D-LMs. In this invited talk, I will present our work towards hybrid 2D/CMOS microchips, with special emphasis on those dedicated to realize memristive operations. I will show state-of-the-art performance as electronic memory, as well as other novel properties that traditional microchips don’t exhibit, and that enable different innovative applications.
Mario Lanza got a PhD in Electronic Engineering (with honors) in 2010 at Universitat Autonoma de Barcelona. In 2010-2011 he was NSFC postdoc at Peking University, and in 2012-2013 he was Marie Curie postdoc at Stanford University. In October 2013 he joined Soochow University as Associate Professor, and in March 2017 he was promoted to Full Professor. Since October 2020 he is an Associate Professor of Materials Science and Engineering at the King Abdullah University of Science and Technology (KAUST), in Saudi Arabia. Prof. Lanza has published over 185 research papers, including 1 Nature, 2 Science, 6 Nature Electronics and multiple IEDM (among others) and has registered four patents (one of them granted with 1 million USD). He is the editor-in-chief of the journal Microelectronic Engineering (Elsevier), a Distinguished Lecturer of the Electron Devices Society (IEEE-EDS) and serves in the board of many other journals and conferences, including IEEE-IEDM and IEEE-IRPS. Prof. Lanza leads a research group formed by 8 PhD students and postdocs, and they investigate how to improve electronic devices and circuits using 2D materials, with special emphasis on resistive switching applications.